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600v high voltage 3 - phase motor driver ics SCM1270MF series data sheet SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 1 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 description the SCM1270MF series are high voltage 3 - phase motor driver ics in which transistors, pre - driver ics (mics), and bootstrap circuits (diodes and resistors) are highly integrated. these products can run on a 3 - shunt current detection system and optimally control the inverter systems of medium - capacity motors that require universal input standards. feature s temperature sensing function in case of abnormal operaion , all ou tputs shut down via the fo1, fo3, and sd pins connected together built - in bootstrap diodes with current limiting resistors (22 ) cmos - compatible input (3.3 v or 5 v) bare lead frame: pb - free (rohs c ompliant) isolation voltage: 2500 v (for 1 m in) ul - recogn ized component (file no.: e118037) fault signal output at protection activation protection s include : undervoltage lockout for power supply high - s ide ( uvlo _vb) : auto - restart low - s ide ( uvlo _vcc) : auto - restart overcurrent protection (ocp) : auto - restart simultaneous on - state prevention: auto - restart typical application v cc mic 1 vb 1 fo 1 ocp 1 lin 1 com 1 hin 1 vcc 1 hs 1 vbb w ls 3 v ls 2 u ls 1 controller i nt com vb 2 sd vt lin 2 com 2 hin 2 vcc 2 hs 2 vb 3 fo 3 ocp 3 lin 3 com 3 hin 3 vcc 3 hs 3 v fo mic 2 mic 3 1 3 4 5 6 7 9 8 11 12 14 13 15 16 17 19 20 21 22 23 24 25 26 28 29 31 32 33 a / d m 27 18 10 2 30 v dc lin 1 hin 1 lin 2 hin 2 lin 3 hin 3 r fo c fo c boot 1 c boot 2 c boot 3 r s d rs r o c o u 1 scm 1270 mf series controller power supply dz vt thermal r vt package dip33 pin pitch: 1.27 mm mold dimensions: 47 mm 19 mm 4.4 mm not to scale selection guide power device : igbt + frd (600 v) i o part number 10 a scm12 71m f 15 a scm12 7 2mf 20 a scm12 74m f 30 a scm12 7 6mf applications for motor drives such as: refrigerator compressor motor air conditioner compressor motor washing machine main motor fan motor pump motor
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 2 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 contents description ------------------------------------------------------------------------------------------------------ 1 contents --------------------------------------------------------------------------------------------------------- 2 1. absolute maximum ratings ----------------------------------------------------------------------------- 4 2. recommended operating conditions ----------------------------------------------------------------- 5 3. electrical characteristics -------------------------------------------------------------------------------- 6 3.1. characteristics of control parts ------------------------------------------------------------------ 6 3.2. bootstrap diode characteristics ----------------------------------------------------------------- 7 3.3. thermal resistance characteristics ------------------------------------------------------------- 7 3.4. transistor characteristics ------------------------------------------------------------------------- 8 3.4.1. scm1271mf ----------------------------------------------------------------------------------- 8 3.4.2. scm1272mf ----------------------------------------------------------------------------------- 9 3.4.3. scm1274mf ----------------------------------------------------------------------------------- 9 3.4.4. scm1276mf --------------------------------------------------------------------------------- 10 4. mechanical characteristics --------------------------------------------------------------------------- 11 5. insulation distance -------------------------------------------------------------------------------------- 11 6. truth table ----------------------------------------------------------------------------------------------- 12 7. block diagram ------------------------------------------------------------------------------------------- 13 8. pin configuration definitions ------------------------------------------------------------------------- 14 9. typical applications ------------------------------------------------------------------------------------ 15 10. phys ical dimensions ------------------------------------------------------------------------------------ 17 10.1. leadform 2552 ------------------------------------------------------------------------------------- 17 10.2. leadform 2557 (long lead type) ------------------------------------------------------------- 18 10.3. reference pcb hole sizes ----------------------------------------------------------------------- 19 11. marking diagram --------------------------------------------------------------------------------------- 19 12. functional descriptions -------------------------------------------------------------------------------- 20 12.1 . turning on and off the ic ---------------------------------------------------------------------- 20 12.2. pin descriptions ----------------------------------------------------------------------------------- 20 12.2.1. u, v, and w ----------------------------------------------------------------------------------- 20 12.2.2. vb1, vb2, and vb3 ------------------------------------------------------------------------- 20 12.2.3. hs1, hs2, and hs3 ------------------------------------------------------------------------- 21 12.2.4. vcc1, vcc2, and vcc3 ------------------------------------------------------------------ 21 12.2 .5. com1, com2, and com3 ---------------------------------------------------------------- 21 12.2.6. hin1, hin2, and hin3; lin1, lin2, and lin3 -------------------------------------- 21 12.2.7. vbb -------------------------------------------------------------------------------------------- 22 12.2.8. ls1, ls2, and ls3 -------------------------------------------------------------------------- 22 12.2.9 . ocp1 and ocp3 ----------------------------------------------------------------------------- 23 12.2.10. fo1 (u - phase) and fo3 (w - phase) ------------------------------------------------------ 23 12.2.11. sd (v - phase) --------------------------------------------------------------------------------- 24 12.2.12. v t ---------------------------------------------------------------------------------------------- 24 12.3. temperature sensing function ----------------------------------------------------------------- 24 12.4. protection functions ------------------------------------------------------------------------------ 25 12.4.1. fault signal output ------------------------------------------------------------------------- 25 12.4.2. shutdown signal input --------------------------------------------------------------------- 25 12.4.3. undervoltage lockout for power supply (uvlo) ----------------------------------- 25 12.4.4. overcurrent protection (ocp) ----------------------------------------------------------- 26 12.4.5. simultaneous on - state prevention ------------------------------------------------------- 28 13. design notes ---------------------------------------------------------------------------------------------- 29 13.1. pcb pattern layout ------------------------------------------------------------------------------ 29
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 3 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 13.2. considerations in heatsink mounting -------------------------------------------------------- 29 13.3. considerations in ic characteristics measurement --------------------------------------- 29 14. calculating power losses and estimating junction temperature ---------------------------- 30 14.1. igbt steady - state loss, p on -------------------------------------------------------------------- 30 14.2. igbt switching loss, p sw ----------------------------------------------------------------------- 31 14 .3. estimating junction temperature of igbt -------------------------------------------------- 31 15. performance curves ------------------------------------------------------------------------------------ 32 15.1. transient thermal resistance curves -------------------------------------------------------- 32 15.1.1. scm1271mf --------------------------------------------------------------------------------- 32 15.1.2. scm1272mf, scm1274mf, scm1276mf -------------------------------------------- 32 15.2. performance curves of control parts --------------------------------------------------------- 33 15.3. performance curves of output parts --------------------------------------------------------- 38 15.3.1. output transistor performance curves ------------------------------------------------ 38 15.3.2. switching losses ----------------------------------------------------------------------------- 40 15.4. al lowable effective current curves ----------------------------------------------------------- 44 15.4.1. scm1271mf --------------------------------------------------------------------------------- 44 15.4.2. scm1272mf --------------------------------------------------------------------------------- 45 15.4.3. scm127 4mf --------------------------------------------------------------------------------- 46 15.4.4. scm1276mf --------------------------------------------------------------------------------- 47 15.5. short circuit soas (safe operating areas) ------------------------------------------------- 48 15.5.1. scm1271mf --------------------------------------------------------------------------------- 48 15.5.2. scm127 2mf --------------------------------------------------------------------------------- 48 15.5.3. scm1274mf --------------------------------------------------------------------------------- 49 15.5.4. scm1276mf --------------------------------------------------------------------------------- 49 16. pattern la yout example ------------------------------------------------------------------------------- 50 17. typical motor driver application ------------------------------------------------------------------- 52 important notes ---------------------------------------------------------------------------------------------- 53
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 4 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 1. absolute maximum ratings current polarities are defined as follows: current going into the ic (sinking) is positive current (+); current coming out of the ic (sourcing) is negative current (?). unless specifically noted, t a = 25 c . parameter symbol conditions rating unit remarks main supply voltage (dc) v dc vbb ? ls x 4 5 0 v main supply voltage (surge) v dc(s urge) vbb ? ls x 500 v igbt breakdown voltage v ces v cc = 15 v , i c = 1 ma , v in = 0 v 6 00 v logic supply voltage v cc v ccx ? com x 20 v v bs vb x ? hs x 20 output current ( 1) i o t c = 25 c 10 a scm12 71 m f 15 scm12 7 2mf 20 scm12 74m f 30 scm12 7 6mf output current (pulse) i op t c = 25 c , p w 1ms , single pulse 20 a scm12 71 m f 30 scm12 7 2mf scm12 74 m f 45 scm12 7 6mf input voltage v in hin x ? com x , lin x ? com x ? 0.5 to 7 v fo pin voltage v fo fo1 ? com1 , fo3 ? com3 ? 0.5 to 7 v sd pin voltage v sd sd ? com2 ? ? 10 to 5 v operating case temperature ( 2) t c(op) ? 3 0 to 100 c junction temperature ( 3 ) t j 150 c storage temperature t stg ?
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 5 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 2. recommended operating conditions parameter symbol conditions min. typ. max. unit remarks main supply voltage v dc com1 = com2 = com3 , vbb ? com ? 300 4 00 v logic supply voltage v cc v ccx ? com x 13.5 ? 16.5 v v bs vb x ? hs x 13.5 ? 16.5 v input voltage (hinx, linx, fox, and sd) v in 0 ? 5.5 v minimum input pulse width t in (min)on 0.5 ? ? s t in (min)off 0.5 ? ? s dead time of input signal t dead 1. 5 ? ? s fo pin pull - up resistor r fo 1 ? 22 k fo pin pull - up voltage v fo 3.0 ? 5.5 v fo pin noise filter capacitor c fo ? ? 1000 p f vt pin pull - down resistor r vt 10 ? ? k bootstrap capacitor c boot 10 ? 220 f shunt resistor r s i p 45 a 12 ? ? m scm12 76m f i p 30 a 18 ? ? scm12 7 2mf scm12 74 m f i p 20 a 27 ? ? scm12 71mf rc filter resistor r o * ? ? 100 rc filter capacitor c o * ? ? 8 200 pf pwm carrier frequency f c ? ? 20 khz * requires the time constants that satisfy the following equation (see also section 12.4.4 ) : r o c o < 0 . 82 s .
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 6 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 3. electrical characteristics current polarities are defined as follows: current going into the ic (sinking) is positive current (+); current coming out of the ic (sourcing) is negative current (?). unless otherwise specified, t a = 25 c , v cc = 15 v . 3.1. characteristics of control parts parameter symbol conditions min. typ. max. unit remarks power supply operation logic operation start voltage v cc(on) v ccx ? com x 10.5 11.5 12.5 v v bs(on) vb x ? hs x 10.5 11.5 12.5 v logic operation stop voltage v cc(off) v ccx ? com x 10.0 11.0 12.0 v v bs(off) vb x ? hs x 10.0 11.0 12.0 v logic supply current i cc vcc1 = vcc2 = vcc3 , com1 = com2 = com3 , vcc pin current in 3 - phase operation ? 3 ? ma i bs vb x ? hs x = 15 v , hin x = 5 v ; vbx pin current in 1 - phase operation ? 140 ? a input signal high level input threshold voltage (hinx, linx , fox, and sd ) v ih 1.5 2.0 2.5 v low level input threshold voltage (hinx, linx , fox, and sd ) v il 1.0 1.5 2.0 v high level input current ( hinx and linx ) i ih v in = 5 v ? 230 500 a low level input current (hinx and linx) i il v in = 0 v ? ? 2 a fault signal output fo pin voltage at fault signal output v fol v fo = 5 v , r fo = 10 k ? ? 0.5 v fo pin voltage in normal operation v foh v fo = 5 v , r fo = 10 k 4.8 ? ? v protection o cp threshold voltage v trip 0.46 0.50 0.54 v o cp hold time t p 20 26 ? s o cp blanking time t bk v trip = 1 v ? 370 ? n s sd pin filtering time t fil(sd) 135 300 ? ns temperature sen s ing voltage * v t t j(mic) = 125 c , v rt = 10 k 2.75 2.81 v * d etermined by the junction temperature of the control parts , not of the output transistors .
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 7 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 3.2. bootstrap diode characteristics parameter symbol conditions min. typ. max. unit remarks bootstrap diode leakage current i lbd v r = 600 v ? ? 10 a bootstrap diode forward voltage v fb i fb = 0.15 a ? 1.1 1.3 v bootstrap diode series resistor r boot 17.6 22.0 26.4 3.3. thermal resistance characteristics parameter symbol conditions min. typ. max. unit remarks junction - to - case thermal resistance ( 1) r (j-c)q ( 2) 1 element operati ng (igbt) ? ? 3.7 c/w scm12 71m f ? ? 3 scm12 7 2mf scm12 74m f scm12 76 m f r (j-c)f ( 3) 1 element operati ng (freewheeling diode) ? ? 4.5 c/w scm12 71m f ? ? 4 scm12 7 2mf scm12 74m f scm12 76 m f (1) refers to a case temperature at the measurement point described in figure 3 - 1 , below. (2) refers to steady - state thermal resistance between the junction of the built - in transistors and the case. for transient thermal characteristics, s ee section 15.1 . (3) refers to steady - state thermal resistance between the junction of the built - in freewheeling diodes and the case. measurement point 1 24 33 25 3 1
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 8 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 3.4. transistor characteristics hinx / linx i d / i c 10 % 0 v ds / v ce t d ( on ) 0 0 90 % t r t on t rr t d ( off ) t f t off figure 3 - 2 . switching characteristics definitions 3.4.1. scm 1271m f parameter symbol conditions min. typ. max. unit collector - to - emitter leakage current i ces v ce = 600 v , v in = 0 v ? ? 1 ma collector - to - emitter saturation voltage v ce( sat ) i c = 10 a , v in = 5 v ? 1.7 2.2 v diode forward voltage v f i f = 10 a , v in = 0 v ? 1.7 2.2 v high - side switching diode reverse recovery time t rr v dc = 300 v , i c = 10 a , v in = 05 v or 50 v, t j = 25 c , inductive load ? 100 ? ns turn - on delay time t d(on) ? 700 ? ns rise time t r ? 100 ? ns turn - off delay time t d(off) ? 1100 ? ns fall time t f ? 90 ? ns low - side switching diode reverse recovery time t rr v dc = 300 v , i c = 10 a , v in = 05 v or 50 v, t j = 25 c , inductive load ? 100 ? ns turn - on delay time t d(on) ? 700 ? ns rise time t r ? 120 ? ns turn - off delay time t d(off) ? 1000 ? ns fall time t f ? 100 ? ns
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 9 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 3.4.2. scm12 72m f parameter symbol conditions min. typ. max. unit collector - to - emitter leakage current i ces v ce = 600 v , v in = 0 v ? ? 1 ma collector - to - emitter saturation voltage v ce( sat ) i c = 15 a , v in = 5 v ? 1.7 2.2 v diode forward voltage v f i f = 15 a , v in = 0 v ? 1.75 2.2 v high - side switching diode reverse recovery time t rr v dc = 300 v , i c = 15 a , v in = 05 v or 50 v, t j = 25 c , inductive load ? 100 ? ns turn - on delay time t d(on) ? 700 ? ns rise time t r ? 110 ? ns turn - off delay time t d(off) ? 1200 ? ns fall time t f ? 100 ? ns low - side switching diode reverse recovery time t rr v dc = 300 v , i c = 1 5 a , v in = 05 v or 50 v, t j = 25 c , inductive load ? 100 ? ns turn - on delay time t d(on) ? 800 ? ns rise time t r ? 120 ? ns turn - off delay time t d(off) ? 1200 ? ns fall time t f ? 100 ? ns 3.4.3. scm12 74m f parameter symbol conditions min. typ. max. unit collector - to - emitter leakage current i ces v ce = 600 v , v in = 0 v ? ? 1 ma collector - to - emitter saturation voltage v ce( sat ) i c = 20 a , v in = 5 v ? 1.7 2.2 v diode forward voltage v f i f = 20 a , v in = 0 v ? 1.9 2.4 v high - side switching diode reverse recovery time t rr v dc = 300 v , i c = 20 a , v in = 05 v or 50 v, t j = 25 c , inductive load ? 100 ? ns turn - on delay time t d(on) ? 900 ? ns rise time t r ? 160 ? ns turn - off delay time t d(off) ? 1300 ? ns fall time t f ? 120 ? ns low - side switching diode reverse recovery time t rr v dc = 300 v , i c = 2 0 a , v in = 05 v or 50 v, t j = 25 c , inductive load ? 100 ? ns turn - on delay time t d(on) ? 900 ? ns rise time t r ? 190 ? ns turn - off delay time t d(off) ? 1300 ? ns fall time t f ? 120 ? ns
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 10 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 3.4.4. scm12 76m f parameter symbol conditions min. typ. max. unit collector - to - emitter leakage current i ces v ce = 600 v , v in = 0 v ? ? 1 ma collector - to - emitter saturation voltage v ce( sat ) i c = 30 a , v in = 5 v ? 1.7 2.2 v diode forward voltage v f i f = 30 a , v in = 0 v ? 1.9 2.4 v high - side switching diode reverse recovery time t rr v dc = 300 v , i c = 30 a , v in = 05 v or 50 v, t j = 25 c , inductive load ? 100 ? ns turn - on delay time t d(on) ? 800 ? ns rise time t r ? 150 ? ns turn - off delay time t d(off) ? 1200 ? ns fall time t f ? 170 ? ns low - side switching diode reverse recovery time t rr v dc = 300 v , i c = 3 0 a , v in = 05 v or 50 v, t j = 25 c , inductive load ? 100 ? ns turn - on delay time t d(on) ? 800 ? ns rise time t r ? 180 ? ns turn - off delay time t d(off) ? 1200 ? ns fall time t f ? 190 ? ns
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 11 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 4. mechanical characteristics parameter conditions min. typ. max. unit heatsink mounting screw torque * 0. 588 ? 0. 784 n?m flatness of heatsink attachment area see figure 4 - 1 . 0 ? 200 m package weight ? 11.8 ? g * when mounting a heatsink, it is recommended to use a metric screw of m3 and a plain washer of 7 mm () together at each end of it. for more details about screw tightening, see section 13.2 . heatsink + - + - measurement position heatsink figure 4 - 1 . flatness measurement position 5. insulation distance parameter conditions min. typ. max. unit clearance between heatsink* and leads. see figure 5 - 1 . 2.0 ? 2.5 mm creepage 3.86 ? 4.26 mm * refers to when a heatsink to be mounted is flat. if your application requires a clearance exceeding the maximum distance given above, use an alternative (e.g., a convex heatsink) that will meet the target requirement. clearance creepage heatsink figure 5 - 1 . insulation distance definitions
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 12 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 6. truth table table 6 - 1 is a truth table that provides the logic level definitions of operation modes. in the case where hinx and linx signals in each phase are high at the same time, the s imultaneous o n - state p revention sets both the high - and low - side transistors off. after the ic recovers from a uvlo_vcc condition, the high - and low - side transistors resume switching, according to the input logic levels of the hinx and linx signals (level - triggered). after the ic recovers from a uvlo_vb condition, the high - side transistors resume switching at the next rising edge of an hinx signal (edge - triggered). table 6 - 1 . truth table for operation modes mode hin x lin x high - side transistor low - side transistor normal operation l l off off h l on off l h off on h h off off shutdown signal input fo 1/fo3/sd = l l l off off h l off off l h off off h h off off undervoltage lockout for high - side power supply (uvlo_vb) l l off off h l off off l h off on h h off off undervoltage lockout for low - side power supply (uvlo_vcc) l l off off h l off off l h off off h h off off overcurrent protection (ocp) l l off off h l off off l h off off h h off off
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 13 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 7. block diagram vb 1 fo 1 ocp 1 lin 1 com 1 hin 1 vcc 1 hs 1 vbb w ls 3 v ls 2 u ls 1 vb 2 sd vt lin 2 com 2 hin 2 vcc 2 hs 2 vb 3 fo 3 ocp 3 lin 3 com 3 hin 3 vcc 3 hs 3 1 3 4 5 8 25 26 28 29 31 32 33 27 2 input logic simultaneous on - state prevention uvl o _ vcc driv e circuit driv e circuit l ev el shif t 6 7 input logic simultaneous on - state prevention driv e circuit driv e circuit t em peratur e sensing l ev el shif t input logic simultaneous on - state prevention driv e circuit driv e circuit ocp l ev el shif t 17 19 20 21 22 18 23 24 9 11 12 14 13 10 15 16 mic 1 mic 2 mic 3 uvl o _ vb uvl o _ vb uvl o _ vcc uvl o _ vb ho 1 lo 1 ho 2 lo 2 ho 3 lo 3 30 filter 300 ns filter 3 s filter 3 s filter 370 ns ocp filter 370 ns
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 14 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 8. pin configuration definitions top view pin number pin name description 1 fo1 u - phase fault signal output and shutdown signal input 2 ocp1 input for u - phase o vercurrent p rotection 3 lin1 logic input for u - phase low - side gate driver 4 com1 u - phase logic ground 5 hin1 logic input for u - phase high - side gate driver 6 vcc1 u - phase logic supply voltage input 7 vb1 u - phase high - side floating supply voltage input 8 hs1 u - phase high - side floating supply ground 9 sd v - phase s hutdown s ignal i nput 10 vt temperature sensing v oltage output 11 lin2 logic input for v - phase low - side gate driver 12 com2 v - phase logic ground 13 hin2 logic input for v - phase high - side gate driver 14 vcc2 v - phase logic supply voltage input 15 vb2 v - phase high - side floating supply voltage input 16 hs2 v - phase high - side floating supply ground 17 fo3 w - phase fault signal output and shutdown signal input 18 ocp3 input for w - phase o vercurrent p rotection 19 lin3 logic input for w - phase low - side gate driver 20 com3 w - phase logic ground 21 hin3 logic input for w - phase high - side gate driver 22 vcc3 w - phase logic supply voltage input 23 vb3 w - phase high - side floating supply voltage input 24 hs3 w - phase high - side floating supply ground 25 vbb positive dc bus supply voltage 26 w w - phase output 27 ls3 w - phase igbt emitter 28 vbb (pin trimmed) positive dc bus supply voltage 29 v v - phase output 30 ls2 v - phase igbt emitter 31 vbb (pin trimmed) positive dc bus supply voltage 32 u u - phase output 33 ls1 u - phase igbt emitter 1 33 25 24 1 33 25 24
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 15 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 9. typical application s cr filters and zener diodes should be added to your application as needed. this is to protect each pin against surge voltages causing malfunctions, and to avoid the ic being used under the conditions exceeding the absolute maximum ratings where critical damage is inevita ble. then, check all the pins thoroughly under actual operating conditions to ensure that your application works flawlessly. v cc mic 1 vb 1 fo 1 ocp 1 lin 1 com 1 hin 1 vcc 1 hs 1 vbb w ls 3 v ls 2 u ls 1 controller i nt com vb 2 sd vt lin 2 com 2 hin 2 vcc 2 hs 2 vb 3 fo 3 ocp 3 lin 3 com 3 hin 3 vcc 3 hs 3 v fo mic 2 mic 3 1 3 4 5 6 7 9 8 11 12 14 13 15 16 17 19 20 21 22 23 24 25 26 28 29 31 32 33 a / d m 27 18 10 2 30 v dc lin 1 hin 1 lin 2 hin 2 lin 3 hin 3 r fo c fo c boot 1 c boot 2 c boot 3 r s d rs r o c o u 1 scm 1270 mf series dz vt thermal r vt controller power supply figure 9 - 1 . typical application u sing a single shunt resistor
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 16 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 v cc mic 1 vb 1 fo 1 ocp 1 lin 1 com 1 hin 1 vcc 1 hs 1 vbb w ls 3 v ls 2 u ls 1 controller i nt com vb 2 sd vt lin 2 com 2 hin 2 vcc 2 hs 2 vb 3 fo 3 ocp 3 lin 3 com 3 hin 3 vcc 3 hs 3 v fo mic 2 mic 3 1 3 4 5 6 7 9 8 11 12 14 13 15 16 17 19 20 21 22 23 24 25 26 28 29 31 32 33 a / d m 27 18 10 2 30 v dc lin 1 hin 1 lin 2 hin 2 lin 3 hin 3 r fo c fo c boot 1 c boot 2 c boot 3 u 1 scm 1270 mf series dz vt thermal r vt r o 1 c o 1 r s 2 r s 3 r o 2 r o 3 c o 2 c o 3 r s 1 d rs 1 d rs 2 d rs 3 controller power supply figure 9 - 2 . typical application u sing three shunt resistors
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 17 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 10. physical dimensions 10.1. leadform 2552 5 x p 1 . 2 7 = 6 . 3 5 5 x p 1 . 2 7 = 6 . 3 5 8 x p 5 . 1 = 4 0 . 8 ( 2 . 6 ) ( 2 . 6 ) m a x 1 . 2 c c 2 . 5 7 1 . 2 7 3 . 7 3 . 2 4 1 . 2 7 3 . 7 d d 1 . 2 7 3 . 7 5 x p 1 . 2 7 = 6 . 3 5 ( 3 8 . 6 ) ( 1 1 . 6 ) 1 . 2 0 . 2 4 7 0 . 3 3 . 2 0 . 1 5 1 9 0 . 3 4 3 . 3 0 . 3 2 . 0 8 0 . 2 0 . 5 0 . 5 a a b b ( 5 ? ) ( 5 ? ) 4 . 4 0 . 3 2 +0.5 0 1 1 . 2 0 . 5 1 7 . 2 5 0 . 5 1 5 . 9 5 0 . 5 1 1 . 4 5 0 . 5 1 2 . 2 5 0 . 5 +0.2 -0.1 0 . 6 +0.2 -0.1 2 0 . 5 + 0 .2 -0.1 0 . 5 +0.2 -0.1 c - c b - b 0 . 7 0 . 5 1 . 2 +0.2 -0.1 + 0 . 2 - 0.1 +0.2 -0.1 0 . 5 + 0 .2 -0.1 a - a d - d u n i t : m m r o o t o f p i n
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 18 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 10.2. leadform 2557 (long lead type) 0 . 6 0 . 6 2 ( 1 2 ) ( 1 1 ) a a b b 4 . 4 0 . 3 +0. 2 0 1 5 . 9 5 0 . 6 1 1 . 4 5 0 . 6 1 2 . 2 5 0 . 6 1 7 . 2 5 0 . 6 5 x p 1 . 2 7 = 6 . 3 5 5 x p 1 . 2 7 = 6 . 3 5 8 x p 5 . 1 = 4 0 . 8 ( 2 . 6 ) ( 2 . 6 ) m a x 1 . 2 2 . 5 7 1 . 2 7 3 . 7 3 . 2 4 1 . 2 7 3 . 7 1 . 2 7 3 . 7 5 x p 1 . 2 7 = 6 . 3 5 ( 0 . 6 5 ) ( 1 1 . 5 ) ( 3 8 . 5 ) c c d d 4 7 0 . 3 1 . 2 0 . 2 3 . 2 0 . 1 5 1 9 0 . 3 4 3 . 3 0 . 3 2 . 0 8 0 . 2 + 0.2 -0.1 0 . 6 +0.2 -0.1 2 0 . 5 + 0 . 2 -0.1 0 . 5 +0.2 -0.1 c - c b - b 0 . 7 0 . 5 1 . 2 +0.2 -0.1 + 0 . 2 - 0 . 1 + 0.2 -0.1 0 . 5 + 0 . 2 -0.1 a - a d - d u n i t : m m r o o t o f p i n 1 4 t o 1 4 . 8 0 t o 0 . 5 0 t o 0 . 5
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 19 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 10.3. reference pcb hole sizes pins 1 to 24 pins 25 to 33 1 . 1 1 . 4 11. marking diagram 24 1 part number lot number : y is the last digit of the year of manufacture ( 0 to 9 ) m is the month of the year ( 1 to 9 , o , n , or d ) dd is the day of the month ( 01 to 31 ) x is the control number 33 25 j apa n ymddx scm 127 xmf branding area 1 33 25 24
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 20 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 12. functional descriptions all the characteristic values given in this section are typical values, unless they are specified as minimum or maximum. for pin descriptions, this section employs a notation system that denotes a pin name with the arbitrary letter ?x?, depending on context. the u - , v - , and w - phases are represented as the pin numbers 1, 2, and 3, respectively. thus, ?the vbx pin? is used when referring to any or all of the vb1, vb2, and vb3 pin s . also, when different pin names are mentioned as a pair (e.g., ?the vbx and hsx pins?), they are meant to be the pins in th e same phase. 12.1. turning on and off the ic the procedures listed below provide recommended startup and shutdown sequences. to turn on the ic properly, do not apply any voltage on the vbb, hinx, and linx pins until the vccx pin voltage has reached a stable sta te (v cc(on) 12.5 v). it is required to fully charge bootstrap capacitors, c bootx , at startup (see section 12.2. 2 ). to turn off the ic, set the hinx and linx pins to logic low (or ?l?), and then decrease the vccx pin voltage. 12.2. pin descriptions 12.2.1. u, v, and w these pins are the outputs of the three phases, and serve as the connection terminals to the 3 - phase motor. the u, v, and w pins are internally connected to the hs1, hs2, and hs3 pins, respectively. 12.2.2. vb1, vb2, and vb3 these are the inputs of the high - side f loating power supplies for the individual phases. voltages across the vbx and hsx pins should be maintained within the recommended range (i.e., the logic supply voltage, v bs ) given in section 2 . in each phase, a bootstrap capacitor, c bootx , should be connected between the vbx and hsx pins. for proper startup, turn on the low - side transistor first, then fully charge the bootstrap capacitor, c bootx . fo r the capacitance of the bootstrap capacitors, c bootx , choose the values that satisfy equations ( 1 ) and ( 2 ) . note that capacitance tolerance and dc bias characteristics must be taken in to account when you choose appropriate values for c bootx . c bootx ( f ) > 800 t l ( off ) ( s ) ( 1 ) 10 f c bootx 220 f ( 2 ) in equation ( 1 ) , let t l(off) be the maximum off - time of the low - side transistor (i.e., the non - charging time of c bootx ), measured in seconds. even while the high - side transistor is off , voltage across the bo otstrap capacitor keeps decreasing due to power dissipation in the ic. when the vbx pin voltage decreases to v bs(off) or less, the high - side undervoltage lockout (uvlo_vb) starts operating (see section 12.4.3.1 ). therefore, actual board checking should be done thoroughly to validate that voltage across the vbx pin maintains over 12.0 v (v bs > v bs(off) ) during a low - frequency operation such as a startup period. as figure 12- 1 shows , a bootstrap diode, d bootx , and a current - limiting resistor, r bootx , are internally placed in series between the vccx and vbx pins . time constant for the charging time of c bootx , , can be computed by equation ( 3 ) : = c boot x r boot x , ( 3 ) where c bootx is the optimized capacitance of the bootstrap capacitor, and r bootx is the resistance of the current - limiting resistor (22 20%). mic 1 vb 1 com 1 vcc 1 u ls 1 6 c boot 1 v cc d boot 1 r boot 1 vbb v dc 8 hs 1 31 32 motor 4 33 r s 1 c dc 7 c p 1 ho lo u 1 figure 12- 1 . bootstrap circuit figure 12- 2 shows an internal level - shifting circuit. a high - side output signal, hox, is generated according to an input signal on the hinx pin. when an input signal on the hinx pin transits from low to high (rising edge), a ?set? signal is generated. when the hinx input signal transits from high to low (falling edge), a ?reset? signal is generated. these two signals are then transmitted to the high - side by the level - shifting circuit and are input to the sr flip - flop circuit. finally, the sr flip - flop circuit feeds an output signal, q (i.e., hox). figure 12- 3 is a timing diagram describing how noise or other detrimental effects will improperly influence the
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 21 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 level - shifting process. when a noise - induced rapid voltage drop between the vbx and hsx pins (?vbx ? hsx?) occurs after the set signal generation, the next reset signal cannot be sent to the sr flip - fl op circuit. and the state of an hox signal stays logic high (or ?h?) because the sr flip - flop does not respond. with the hox state being held high (i.e., the high - side transistor is in an on - state) , the next linx signal turns on the low - side transistor and cause s a simultaneously - on condition , which may result in critical damage to the ic. to protect the vbx pin against such a noise effect, add a bootstrap capacitor, c bootx , in each phase. c bootx must be placed near the ic , and be connected between the vbx and hsx pins with a minimal length of traces. to use an electrolytic capacitor, add a 0.01 f to 0.1 f bypass capacitor, c px , in parallel near these pins used for the same phase. hinx input logic pulse generator comx set reset hox vbx hsx s r q u1 figure 12- 2 . internal level - shifting circuit hinx set reset vbx - hsx q 0 v bs ( off ) 0 0 0 0 v bs ( on ) stays logic high figure 12- 3 . waveforms at vbx ? hsx voltage drop 12.2.3. hs1, hs2, and hs3 these pins are the ground s of the high - side floating power supplies for each phase , and are connected to t he negative no de s of bootstrap capacitor s , c bootx . the hs1, hs2, and hs3 pins are internally connected to the u, v, and w pins, respectively. 12.2.4. vcc1, vcc2, and vcc3 th ese are the logic supply pin s for the built - in pre - driver ic s . the vcc1, vcc2, and vcc3 pins must be externally connected on a pcb because they are not internally connected. to prevent malfunction induced by supply ripples or other factors, put a 0.01 f to 0.1 f cer amic capacitor, c vccx , near these pins. to prevent damage caused by surge voltages, put a n 18 v to 20 v zener diode, dz, between the vccx and comx pins. voltages to be applied between the vccx and comx pins should be regulated within the recommended operat ional range of v cc , given in section 2 . 12.2.5. com1, com2, and com3 th ese are the logic ground pin s for the built - in pre - driver ic s . for proper control, the control parts in each phase must be connected to the corresponding ground pin. the com1, com2, and com3 pins should be connected externally on a pcb because they are not internally connected. varying electric potential of the logic ground can be a caus e of improper operations. therefore, connect the logic ground as close and short as possible to a shunt resistor, r s , at a single - point ground (or star ground) which is separated from the power ground (see figure 12- 4 ). moreover, extreme care should be taken when wiring so that currents from the power ground do not affect the com x pin. com 1 vbb ls 3 ls 2 ls 1 com 2 com 3 v dc r s c dc c s ocp 1 , ocp 3 33 27 30 25 4 12 20 create a single - point ground ( a star ground ) near r s , but keep it separated from the power ground . connect com 1 , com 2 , and com 3 on a pcb . u 1 figure 12- 4 . connections to logic ground 12.2.6. hin1, hin2, and hin3 ; lin1, lin2, and lin3 these are the input pins of the internal motor drivers for each phase. the hinx pin acts as a high - side controller ; the linx pin acts as a low - side con troller. figure 12- 5 shows an internal circuit diagram of the hinx or linx pin. this is a cmos schmitt trigger
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 22 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 circuit with a built - in 22 k pull - down resistor, and its input logic is active high. input signals across the hinx ? comx and the linx ? comx pins in each phase should be set within the ranges provided in table 12- 1 , below. note that dead time setting must be done for hinx and linx signals because the ic does not have a dead time generator. the higher pwm carrier frequency rises, the more switching loss increases. hence, the pwm carrier frequenc y must be set so that operational case temperatures and junction temperatures have sufficient margins against the absolute maximum ranges , specified in section 1 . if the signals from the microcontroller become unstable, the ic may result in malfunctions. to avoid this event, the outputs from the microcontroller output line should not be high impedance. also, if the traces from the microcontroller to the hinx or linx pin (or both) are too long, the traces may be interfered by noise. therefore, it is recommended to add an additional filter or a pull - down resistor near the hinx or linx pin as needed (see figure 12- 6 ). here are filter circuit constants for reference: - r in1 x : 33 to 100 - r in2 x : 1 k to 10 k - c in x : 100 pf to 1000 pf care should be taken when adding r in1x and r in2x to the traces. when they are connected each other, the input voltage of the hinx and linx pins becomes slightly lower than the output voltage of the microcontroller. table 12 - 1 . input signals for hinx and linx pins parameter high level signal low level signal input voltage 3 v < v in < 5.5 v 0 v < v in < 0.5 v input pulse width 0.5 s 0.5 s pwm carrier frequency 20 khz dead time 1.5 s hinx ( linx ) comx 5 v 2 k 22 k u 1 figure 12- 5 . internal circuit diagram of hinx or linx pin r in 1 r in 2 c in u1 input signal controller hinx ( linx ) scm 1270mf figure 12- 6 . filter circuit for hinx or linx pin 12.2.7. vbb this is the input pin for the main supply volt age, i.e., the positive dc bus. all of the igbt collectors of the high - side are connected to this pin. voltages between the vbb and comx pins should be set within the recommended range of the main supply voltage, v dc , given in section 2 . to suppress surge voltages, put a 0.01 f to 0.1 f bypass capacitor, c s , near the vbb pin and an electrolytic capacitor, c dc , with a minimal leng th of pcb traces to the vbb pin. 12.2.8. ls1, ls2, and ls3 these are the emitter pins of the low - side igbts. for current detection, the ls1, ls2, and ls3 pins should be connected externally on a pcb via a shunt resistor, r s , to the comx pin. otherwise, malfunction may occur because a longer circuit trace increases its inductance and thus increases its susceptibility to improper operations. in applications where long pcb traces are required, add a fast recovery diode, d rs , between the lsx and comx pins in order to p revent the ic from malfunctioning. com 1 vbb ls 3 ls 2 ls 1 com 2 com 3 v dc r s c dc c s 33 27 30 25 4 12 20 put a shunt resistor near the ic with a minimum length to the lsx pin . add a fast recovery diode to a long trace . d rs u 1 ocp 1 , ocp 3 figure 12- 7 . connections to lsx pin
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 23 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 12.2.9. ocp1 and ocp3 these pins serve as the inputs of the o vercurrent p rotection (ocp) for monitoring the currents going through the output transistors. section 12.4.4 provides further information about the ocp circuit configuration and its mechanism. 12.2.10. fo1 (u - p hase) and fo3 ( w- p hase ) each pin operates as the fault signal output and shutdown signal input for the corresponding phase, the u - or w - phase. sections 12.4.1 and 12.4.2 explain the two functions in detail, respectively. figure 12- 8 illustrates an internal circuit diagram of the fox pin and its peripheral circuit. because of its open - drain nature, each of the fox pins sho uld be tied by a pull - up resistor, r fo , to the external power supply. the external power supply voltage (i.e., the fo pin pull - up voltage , v fo ) should range from 3.0 v to 5.5 v. figure 12- 10 shows a relation between the fox pin voltage and the pull - up resistor, r fo . when the pull - up resistor, r fo , has a too small resistance, the fox pin voltage at fault signal output becomes high due to the on - resistance of a built - in mosfet, q fo ( figure 12- 8 ). therefore, it is recommended to use a 1 k to 22 k pull - up resistor when the l ow l evel i nput t hreshold v oltage of the microcontroller, v il , is set to 1.0 v. to suppress noise, add a filter capacitor, c fo , near the ic with minimizing a trace length between the fox and comx pins. note that, however, this additional filtering allows a delay time, t d(fo) , to occur, as seen in figure 12- 9 . the delay time, t d(fo) , is a period of time which starts when the ic receives a fault flag turning on the internal mosfet, q fo , and continues until when the fox pin reaches its threshold voltage (v il ) of 1.0 v or below (put simply, until the time when the ic detects a low state, ?l?). figure 12- 11 shows how the delay time, t d(fo) , and the noise filter capacitor, c fo , are related. to avoid the repetition of ocp activations, the external microcontroller must shut off any input signals to the ic within an ocp hold time, t p , which occurs after the internal mosfet (q fo ) turn - on. t p is 1 5 s where minimum values of thermal characteristics are taken into account ( f or more details, see section 12.4.4 ) . w hen the l ow l evel i nput t hreshold v oltage of the microcontroller, v il , is set to 1.0 v, c fo must be se t to 1000 pf . this is because th e v - phase delay time, t d(sd) , at ocp activation is to be taken into account (see section 12.2.11 ). m otor operation must be controlled by the external microcontroller so that it can immediately stop the motor when fault signals are detected. t o resume motor operation s thereafter , set the motor to be resumed after a lapse of 2 seconds. 5 v 50 2 k 1 m k) t j = 25 c max. typ. min. 0.00 0.05 0.10 0.15 0.20 0 200 400 600 800 1000 delay time, t d(fo) (s) c fo (p f) t j = 25 c max. typ. min.
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 24 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 12.2.11. sd ( v - p hase) this is the shutdown signal input for the v - phase . figure 12- 12 illustrates an internal circuit diagram of the sd pin and its peripheral circuit. the sd pin is connected to the fo1 and fo3 pins , allowing the v - phase output transistors to be shut down by a fault signal transmitted when one or more of the protections in either the u - or w - phase is activated. when the sd pin voltage decreases to the low le vel input threshold voltage ( v il , 1.5 v ) or less , and remains in this condition for a period of the s d pin filtering time ( t fil(sd) , 300 ns) or longer, the v - phase transistors turn off . figure 12- 14 shows a relation between t d(sd) and the capacitance of c fo . as defined in figure 12- 13, t d(sd) is a period of time from when the internal mosfet ( q fox ) is turned on by activated protections until the v - phase output ( ho2 ) turns off . if , after the u - or w - phase ocp activation, an fox signal detection by the sd pin takes too long, permanent damage to the v - phase output transistors may occur . thus, the value of c fo must be set to 1000 pf . 5 v sd com 2 9 v fo r fo c fo 12 fo 1 fo 3 500 k? 2 k? 12.2.12. vt this pin outputs temperature sensing voltage s . the external microco ntroller can monitor the junction temperature of the internal control ic , not of the output transistors, with the vt pin . for more detail s, see section 12.3 . 12.3. temperature sensing function the microco ntroller can monitor the junction temperature of the internal control ic , through temperature sensing vo ltage s that the vt pin outputs. t he SCM1270MF series does not includ e any protection s against overtemperature, such as an ic shutdown or a fault flag . th erefore , the ic must be set to stop its operation as it detects an abnormal heating state with temperature sensing voltage s. a typical example is turn ing off input signals from the microcontroller . figure 12- 15 shows a relation between the vt pin voltage and temperature . table 12- 2 and table 12- 3 provide the detail s of variation s found in figure 12- 15. t emperature sensing voltage s may exceed 3.0 v , causing permanent damage to the ic in the worst case. to protect the parts connected to the vt pin such as the microcontroller, add a clamp diode , dz vt , between the microcontroller power supply and the vt pin. figure 12- 15. vt pin voltage vs. internal control ic junction temperature, t j(mic) table 12 - 2 . t j(mic) v ariation o n vt pin voltage vt pin voltage (v) t j(mic) (c) 1.95 50 8 2.7 5 125 5 table 12 - 3 . vt pin voltage v ariation o n t j(mic) t j(mic) ( c ) vt pin voltage (v) 50 1.95 0.9 125 2.75 0.06 0 0.1 0.2 0.3 0.4 0.5 0.6 0 200 400 600 800 1000 t d(sd) (s) c fo ( p f) t j = 25 c max. typ. min. 1.5 2.0 2.5 3.0 3.5 25 50 75 100 125 150 vt pin voltage (v) junction temperature ,t j(mic) (c) max. typ. min.
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 25 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 vt com 2 10 dz vt 12 c vt controller controller power supply figure 12- 16. v t pin peripheral circuit 12.4. protection functions this section describes the various protection circuits provided in the SCM1270MF series. the protection circuits include the u ndervoltage l ockout for power supplies (uvlo), the s imultaneous o n - state p revention , and the o vercurrent p rotection (ocp). in case one or more of these protection circuits are activated, the fo x pin outputs a fault signal; as a result, the external microcontroller can stop the operations of the three phases by receiving the fault signal. the external microcontroller can also shut down the ic operations by inputting a fault signal to the fo x pin. in the following functional descriptions, ?hox? denotes a gate input signal on the high - side transistor , whereas ?lox? denotes a gate input signa l on the low - side transistor (see also the diagram in section 7 ). ?vbx ? hsx? refers to the voltages between the vbx and hsx pin s . 12.4.1. fault signal outpu t in case one or more of the following protections are actuated, an internal transistor, q fo x , turns on , then the fo x pin becomes logic low (0.5 v). the fo1 , fo3, and sd pins must be all connected by external traces. 1) low - side u ndervoltage l ockout (uvlo_vcc) 2) overcurrent p rotection (ocp) 3) simultaneous o n - state p revention while the fox pin is in the low state, the high - and low - side transistors of each phase turn off. in normal operation, the fox pin outputs a high signal of 5 v. the fault signal outpu t time of the fo x pin at ocp activation is the ocp hold time (t p ) of 26 s (typ.), fixed by a built - in feature of the ic itself (see section 12.4.4 ). the external microcontroller receives the fault signals with its interrupt pin (int), and must be programmed to put the h in x and l in x pin s to logic low within the predetermined ocp hold time, t p . if you need to resume the motor operation thereafter , set the motor to be resumed after a lapse of 2 seconds. 12.4.2. shutdown signal input the fo1, fo 3 , and sd pins can be the input pins of shutdown signa ls. when the fox and sd pins become logic low, the high - and low - side transistors of each phase turn off. the voltages and pulse widths of shutdown signals should be set as listed in table 12- 4 . table 12 - 4 . shutdown signals parameter high level signal low level signal input voltage 3 v < v in < 5.5 v 0 v < v in < 0.5 v input pulse width 3.0 s 3.0 s the fo1, fo 3 , and sd pins must be all connected , as shown in figure 12- 17 . if an abnormal condition is detected by either the u - and w - phase monolithic ics (micx), the high - and low - side transistors of all phases turn off. fo 1 i nt sd fo 3 com 1 r fo c fo v fo u 1 1 9 17 20 com 2 com 3 12 4 figure 12- 17. all - phase shutdown circuit 12.4.3. undervoltage lockout for power supply (uvlo) in case the gate - driving voltages of the output transistors decrease, their steady - state power dissipations increase. this overheating condition may cause permanent damage to the ic in the worst case. to prevent this event, the SCM1270MF series has the u ndervoltage l ockout (uvlo) circuits for both of the high - and low - side power supplies in each monolithic ic (mic x ). 12.4.3.1. undervoltage lockout for h igh - side power supply (uvlo_vb) figure 12- 18 shows operational waveforms of the undervoltage lockout operation for high - side power supply (i.e., uvlo_vb). when the voltage between the vbx and hsx pins (vbx ? hsx) decreases to the logic op eration stop
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 26 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 voltage (v bs(off) , 11.0 v) or less, the uvlo_vb circuit in the corresponding phase gets activate d and sets an hox signal to logic low. when the volta ge between the vbx and hsx pins increases to the logic operation start voltage (v bs(on) , 11.5 v) or more, the ic releases the uvlo_vb condition. then, the hox signa l become s logic high at the rising edge of the first input command after the uvlo_vb release. any fault signals are not output from the fo x pin during the uvlo_vb operation. in addition, the vbx pin has an internal uvlo_vb filter of about 3 s, in order to prevent noise - induced malfunctions. linx hinx vbx - hsx hox lox fox v bs ( off ) v bs ( on ) hox restarts at positive edge after uvl o _ vb release . no fox output at uvl o _ vb . 0 0 0 0 0 0 uvlo release uvl o _ vb operation about 3 s figure 12- 18. uvlo_vb operational waveforms 12.4.3.2. undervoltage lockout for low - side power supply (uvlo_vcc) figure 12- 19 shows operational waveforms of the undervoltage lockout operation for low - side power supply (i.e., uvlo_vcc). the vcc1, vcc2, and vcc3 pins must be all connected by external traces on a pcb . when the vccx pin voltage decreases to the logic operation stop voltage (v cc(off) , 11.0 v) or less, the uvlo_vcc circuit in the corresponding pha se gets activate d and sets both of hox and lox signals to logic low. when the vccx pin voltage increases to the logic operation start voltage (v cc(on) , 11.5 v) or mo re, the ic releases the uvlo_vcc operation . then it resumes transmitting the hox and lox signals according to input commands on the hinx and linx pins. during the uvlo_vcc operation, the fox pin becomes logic low and sends fault signals. in addition, the v ccx pin has an internal uvlo_vcc filter of about 3 s, in order to prevent noise - induced malfunctions. about 3 s lin 1 / lin 3 hin 1 / hin 3 vccx ho 1 / ho 3 lo 1 / lo 3 fo 1 / fo 3 v cc ( off ) v cc ( on ) lox responds to input s ignal . 0 0 0 0 0 0 uvl o _ vcc operation figure 12- 19. uvlo_vcc operational waveforms (u - or w - phase ) t fil ( sd ) about 3 s lin 2 hin 2 vccx ho 2 lo 2 fo 1 / fo 3 v cc ( off ) v cc ( on ) lo 2 responds to input signal . 0 0 0 0 0 0 uvl o _ vcc operation sd 0 t fil ( sd ) figure 12- 20. uvlo_vcc operational waveforms ( v - phase ) 12.4.4. overcurrent protection (ocp) the control ics for the u - and w - phase s ha ve the o vercurrent p rotection (ocp) circuit each . figure 12- 21 is an internal circuit diagram describing the ocpx pin and its peripheral circuit. the ocpx pin detects overcurrents with voltage across an external shunt resistor, r s . because the ocpx pin is internally pulled
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 27 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 down, the ocpx pin voltage increases proportionally to a rise in the current running through the shunt resistor, r s . figure 12- 22 shows the ocp operational wave forms when the ocp1 pin (u - phase) or the ocp3 pin (w - phase) detects an overcurrent. when the ocpx pin voltage increases to the o cp threshold voltage ( v trip , 0.50 v) or more, and remains in this condition for a period of the o cp blanking time (t bk , 370 n s) or longer, the ocp x circuit is activated . when an internal delay time ( t delay ) of 0.3 s has elapsed after the ocp activation, the enabled ocpx circuit shuts off the corresponding output transistors and puts the fox pin into a low state. then, output current decreases as a result of the output transistors turn - off. even if the ocpx pin voltage falls below v trip , the ic holds the fox pin in the low state for a fixed ocp hold time (t p ) of 26 s (typ.). then, the output transistors operate according to input signals. the v - phas e control circuit being built without opc, an overcurrent signal from the v - phase must be input to the ocpx pin that detect s a u - or w - p hase ocp signal. the v - phase sd pin is connected to the u - and w - phase fox pins for this v - phase ocp alternative . when the ocpx pin detects overcurrents, the sd pin, as well as the fox pin , goes into logic low , and then the v - phase output transistors turn off after a lapse of the sd pin filtering time (t fil(sd) , 300 ns ) , as in figure 12- 23. a turn - off delay time of t he v - phase output transistors depends on the capacitance of the fo pin capacitor, c fo . if the delay time is too long, the output transistors may be destroyed due to overcurrent. thus, the value of c fo must be set to 1000 pf. the ocp is used for detecting abnormal conditions, such as an output transistor shorted. in case short - circuit conditions occur repeatedly, the output transistors can be destroyed. to prevent such event, motor operation must be controlled by the external microcontroller so that it can immediately stop the motor when fault signals are detected. the external microcontroller receives the fault signals with its interrupt pin (int), and must be programmed to put the h in x and l in x pin s to logic low within the predetermined ocp hold time, t p . if you need to resume the motor operation thereafter , set the motor to be resumed after a lapse of 2 seconds. for proper shunt resistor setting, your application must meet the following: use the shunt resistor that has a recommended resistance, r s (see section 2 ). set the ocpx pin input voltage to vary within the rated ocp pin voltages, v ocp (see section 1 ). keep the current through the output transistors below the rated output current (pulse), i op (see section 1 ). it is required to use a resistor with low internal inductance because high - frequency switching current will flow through the shunt resistor, r s . in addition, choose a resistor with allowable power dissipation according to your application. when you connect a cr filter (i.e., a pair of a filter resistor, r o , and a filter capacitor, c o ) to the ocpx pin, care should be taken in setting the time constants of r o and c o . the larger the time constant, the longer the time that t he ocpx pin voltage rises to v trip . and this may cause permanent damage to the transistors. consequently, a propagation delay of the ic must be taken into account when you determine the time constants. for r o and c o , their time constants must be set to 0. 82 s . the filter capacitor, c o , should also be placed near the ic, between the ocpx and comx pins with a minimal length of traces. note that overcurrents are undetectable when one or more of the u, v, and w pins or the ir traces are shorted to ground (ground fault). in case any of these pins falls into a state of ground fault, the output transistors may be destroyed. vbb lsx com ocpx comx a / d r s r o c o d rs v trip 100 k - + 370 ns ( typ .) u 1 2 k
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 28 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 t fil ( sd ) lin 2 hin 2 ho 2 lo 2 fo 1 / fo 3 0 0 0 0 0 ocp 2 0 v trip t bk t bk t de lay 0 . 3 s ( typ .) t p t bk ho 2 responds to input signal . fox res tarts automatically after t p . sd 0 t fil ( sd ) 0 figure 12- 23. ocp operational waveforms ( v - phase ) 12.4.5. simultaneous on - state prevention in case both of the hinx and linx pins receive logic high signals at once, the high - and low - side transistors turn on at the same time, causing overcurrents to pass through. as a result, the switching transistors will be destroyed. to prevent this event, the simultaneous on - state prevention circuit is built into each of the monolithic ics (micx). figure 12- 24 shows o perational w aveforms of the s imultaneous o n - state p revention . about 0 . 8 s linx hinx hox lox fox simultaneous on - state prevention enabled 0 0 0 0 0 about 0 . 8 s figure 12- 24. operational waveforms of simul taneous on - state prevention when logic high signals are asserted on the hinx and linx pins at once, as in figure 12- 24 , this function gets activated a nd turns the high - and low - side transistors off. then, during the function is being enabled, the fox pin becomes logic low and sends fault signals. after the ic comes out of the simultaneous on - state condition, ?hox? and ?lox? start responding in accordance with hinx and linx input commands again. to prevent noise - induced malfunctions, the s imultaneous o n - state p revention circuit has a filter of about 0.8 s. note that this function does not have any of dead - time programming circuits. therefore, input signals to the hinx and lin pins must have proper dead times as defined in section 12.2.6 .
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 29 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 13. design notes this section also employs the notation system described in the beginning of the previous section. 13.1. pcb pattern layout figure 13- 1 shows a schematic diagram of a motor driver circuit. the motor driver circuit consists of current paths having high frequencies and high voltages, which also bring about negative influences on ic operation, noise interference , and power dissipation. therefore, pcb trace layouts and component placements play an important role in circuit designing. current loops, which have high frequencies and high voltages, should be as small and wide as possible, in order to maintain a low - impedance state. in addition, ground traces should be as wide and short as possible so that radiated emi levels can be reduced. mic 1 vbb w ls 3 v ls 2 u ls 1 mic 2 mic 3 26 29 32 m 27 30 v dc 25 33 high - frequency , high - voltage current loops should be as small and wide as possible . ground traces should be wide and short . u 1 figure 13- 1 . high - freq uency, high - voltage current paths 13.2. considerations in heatsink mounting the following are the key considerations and the guidelines for mounting a heatsink: it is recommended to use a pair of a metric screw of m3 and a plain washer of 7 mm (). to tighten th e screws, use a torque screwdriver. tighten the two screws firstly up to about 30% of the maximum screw torque, then finally up to 100% of the prescribed maximum screw torque. perform appropriate tightening within the range of screw torque defined in secti on 4 . when mounting a heatsink, it is recommended to use silicone greases. if a thermally conductive sheet or an electrically insulating sheet is used, package cracks may be occurred due to creases at screw tightening. therefore, you should conduct thorough evaluations before using these materials. when applying a silicone grease, make sure tha t there must be no foreign substances between the ic and a heatsink. extreme care should be taken not to apply a silicone grease onto any device pins as much as possible. the following requirements must be met for proper grease application: ? grease thicknes s: 100 m ? heatsink flatness: 100 m ? apply a silicone grease within the area indicated in figure 13- 2 , below. h eatsin k thermal silicone grease application area 3 . 1 3 . 1 37 . 6 unit : mm 5 . 8 5 . 8 m 3 m 3 screw hole screw hole figure 13- 2 . reference application area for thermal silicone grease 13.3. considerations in ic characteristics measurement when measuring the breakdown voltage or leakage current of the transistors incorporated in the ic , note that the gate and emitter of each transistor should have the same potential. moreover, care should be taken when performing the measurements , because the collectors of the high - side transistors are all internally connected to the vbb pin. the output (u, v, and w) pins are connected to the emitters of the corresponding high - side transistors , whereas the lsx pins are connected to the emitters of the low - side transistors. the gates of the high - side transistors are pulled down to the corresponding output (u, v, and w) pins; similarly, the gates of the low - side transistors are pulled down to the comx pins. when measuring the breakdown voltage or leakage current of the transistors incorporated in the ic, note that all of the output (u, v, and w), lsx, and c om x pins must be appropriately connected. otherwise the switching transistors may result in permanent damage. the following are circuit diagrams representing typical measurement circuits for breakdown voltage: figur e 13- 3 shows the high - side transistor (q 1h ) in the u - phase ; figure 13- 4 shows the low - side tr ansistor (q 1l )
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 30 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 in the u - phase. and all the pins that are not represented in these figures are open. before conducting a measurement, be sure to isolate the ground of the to - be - measured phase from those of other two phases not to be measured. then, in each of the two phases, which are separated not to be measured, connect the lsx and comx pins each other at the same potential, and leave them unused and floated. mic 1 com 1 vbb w ls 3 v ls 2 u ls 1 com 2 com 3 mic 2 mic 3 20 31 27 30 q 1 h q 1 l q 2 h q 2 l q 3 h q 3 l 26 33 29 12 4 32 25 v u 1 figure 13- 3 . typical measurement circuit for high - side transistor (q 1h ) in u - p hase mic 1 com 1 vbb w ls 3 v ls 2 u ls 1 com 2 com 3 mic 2 mic 3 20 31 27 30 25 q 1 h q 1 l q 2 h q 2 l q 3 h q 3 l 26 33 v 29 12 4 32 u 1 figure 13- 4 . typical measurement circuit for low - side transistor (q 1l ) in u - p hase 14. calculating power losses and esti mating junction temperature this section describes the procedures to calculate power losses in a switching transistor, and to estimate a junction temperature. note that the descriptions listed here are applicable to the SCM1270MF series, which is control led by a 3 - phase sine - wave pwm driving strategy. total power loss in an igbt can be obtained by taking the sum of steady - state loss, p on , and switching loss, p sw . the following subsections contain the mathematical procedures to calculate the power losses in an igbt and its junction temperature. for quick and easy references, we offer calculation support tools online. please visit our website to find out more. dt0025: scm1200mf series calculation tool http://www.semicon.sanken - ele.co.jp/en/calc - tool/scm 12xxmf_caltool_en.html 14.1. igbt steady - state loss, p on steady - state loss in an igbt can be computed by using the v ce(sat) vs. i c curves, listed in section 15.3.1 . as expressed by the curves in figure 14- 1 , linear approximations at a range the i c is actually used are obtained by: v ce(sat) = i c + . the values gained by the above calculation are then applied as parameters in equation (4), be low. hence, the equation to obtain the igbt steady - state loss, p on , is: p on = 1 2 n v gi ( sat ) ( c ( t ) dt d t ? 4 = 1 2 ? m cos e p i q 6 + 2 ? 1 2 + 8 m cos ? i m . ( 4 ) where: v ce(sat) is the collector - to - emitter saturation voltage o f the igbt ( v ) , i c is the collector current of the igbt ( a ) , dt is the duty cycle, which is given by dt = 1 + m sin ( + ) 2 , m is the modulation index (0 to 1), cos is the motor power factor (0 to 1), i m is the effective motor current ( a ) , is the slope of the linear approximat ion in the v ce(sat) vs. i c curve, and is the intercept of the linear approximation in the v ce(sat) vs. i c curve.
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 31 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 figure 14- 1 . linear approximate equation of v ce(sat) vs. i c curve 14.2. igbt switching loss, p sw switching loss in an igbt, p sw , can be calculated by equation ( 5 ) , letting i m be the effective current value of the motor: p sw = 2 f c e i m v dc 300 . ( 5 ) where: f c is the pwm carrier frequency ( hz ) , v dc is the main power supply voltage ( v ), i.e., the vbb pin input voltage, and e is the slope of the switching loss curve (see section 15.3.2 ). 14.3. estimating junction temperature of igbt the junction temperature of an igbt, t j , can be estimated with equation ( 6 ) : t j = r ( j ? c ) q ( p on + p sw ) + t c . ( 6 ) where: r (j-c)q is the junction - to - case thermal resistance per igbt ( c/w ) , and t c is the case temperature ( c ) , measured at the point defined in figure 3 - 1 . y = 0.108x + 0.831 y = 0.036x + 1.359 0.0 0.5 1.0 1.5 2.0 2.5 0 1 2 3 4 5 6 7 8 9 10 v ce(sat) (v) i c (a) vcc=15v 75 c 125 c 25 c
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 32 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15. performance curves 15.1. transient thermal resistance curves the following graphs represent transient thermal resistance (the ratios of transient thermal resistance), with steady - state thermal resistance = 1. 15.1.1. scm12 71mf 15.1.2. scm12 72mf , scm12 74 mf , scm12 76mf 0.01 0.10 1.00 1 10 100 1000 10000 ratio of transient thermal resistance time (ms) 0.01 0.10 1.00 1 10 100 1000 10000 ratio of transient thermal resistance time (ms)
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 33 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.2. performance curves of control parts figure 15- 1 to figure 15- 23 provide performance curves of the control parts integrated in the scm 1200mf series, including variety - dependent characteristics and thermal characteristics. t j represents the junction temperature of the control parts. table 15 - 1 . typical characteristics of control parts figure number figure caption figure 15 - 1 logic supply current in 3 - phase operation, i cc vs. t c figure 15- 2 logic supply current in 3 - phase operation, i cc vs. vccx pin voltage, v cc figure 15 - 3 logic supply current in 1 - phase operation (hinx = 0 v), i bs vs. t c figure 15 - 4 logic supply current in 1 - phase operation (hinx = 5 v), i bs vs. t c figure 15- 5 logic supply current in 1 - phase operation (hinx = 0 v), i bs vs. vbx pin voltage, v b figure 15 - 6 logic operation start voltage, v bs(on) vs. t c figure 15 - 7 logic operation stop voltage, v bs(off) vs. t c figure 15 - 8 logic operation start volta ge, v cc(on) vs. t c figure 15 - 9 logic operation stop voltage, v cc(off) vs. t c figure 15 - 10 uvlo_vb filtering time vs. t c figure 15 - 11 uvlo_vcc filtering time vs. t c figure 15- 12 input current at high level (hinx or linx ), i in vs. t c figure 15 - 13 high level input signal threshold voltage, v ih vs. t c figure 15 - 14 low level input signal threshold voltage, v il vs. t c figure 15- 15 minimum transmittable pulse width for high - side switching, t hin(min) vs. t c figure 15 - 16 minimum transmittable pulse width for low - side switching, t lin(min) vs. t c figure 15 - 17 fo x pin voltage in normal operation, v fol vs. t c figure 15- 18 o cp threshold voltage, v trip vs. t c figure 15 - 19 blanking time, t bk + propagation delay, t d elay vs. t c figure 15 - 20 o cp hold time, t p vs. t c figure 15 - 21 filtering time of simultaneous on - state prevention vs. t c figure 15- 22 sd pin filter ing time , t fil(sd) vs. t c figure 15 - 23 v - phase shutdown period, t d(sd) vs. t c
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 34 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 figure 15- 1 . logic supply current in 3 - phase operation, i cc vs. t c figure 15- 2 . logic supply current in 3 - phase operation, i cc vs. vccx pin voltage, v cc figure 15- 3 . logic supply current in 1 - phase operation (hinx = 0 v), i bs vs. t c figure 15- 4 . logic supply current in 1 - phase operation (hinx = 5 v), i bs vs. t c figure 15- 5 . logic supply current in 1 - phase operation (hinx = 0 v), i bs vs. vbx pin voltage, v b figure 15- 6 . logic operation start voltage, v bs(on) vs. t c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 - 30 0 30 60 90 120 150 i cc (ma) t c (c) max. typ. min. vcc x= 15 v, hinx = 0 v, linx = 0 v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 12 13 14 15 16 17 18 19 20 i cc (ma) v cc ( v) hin x= 0 v, linx = 0 v 30 c 25 c 125 c 0 50 100 150 200 250 - 30 0 30 60 90 120 150 i bs (a) t c (c) vbx = 15 v, hinx = 0 v max. typ. min. 0 50 100 150 200 250 - 30 0 30 60 90 120 150 i bs (a) t c (c) vbx = 15 v, hinx = 5 v max. typ. min. 0 20 40 60 80 100 120 140 160 180 12 13 14 15 16 17 18 19 20 i bs (a) v b (v) vbx = 15 v 30 c 25 c 125 c 10.50 10.75 11.00 11.25 11.50 11.75 12.00 12.25 12.50 - 30 0 30 60 90 120 150 v bs(on) (v) t c (c) max. typ. min.
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 35 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 figure 15- 7 . logic operation stop voltage, v bs(off) vs. t c figure 15- 8 . logic operation start voltage, v cc(on) vs. t c figure 15- 9 . logic operation stop voltage, v cc(off) vs. t c figure 15- 10. uvlo_vb filtering time vs. t c figure 15- 11. uvlo_vcc filtering time vs. t c figure 15- 12. input current at high level (hinx or linx), i in vs. t c 10.0 10.2 10.4 10.6 10.8 11.0 11.2 11.4 11.6 11.8 12.0 - 30 0 30 60 90 120 150 v bs(off) (v) t c (c) max. typ. min. 10.50 10.75 11.00 11.25 11.50 11.75 12.00 12.25 12.50 - 30 0 30 60 90 120 150 v cc(on) (v) t c (c) max. typ. min. 10.0 10.2 10.4 10.6 10.8 11.0 11.2 11.4 11.6 11.8 12.0 - 30 0 30 60 90 120 150 v cc(off) (v) t c (c) max. typ. min. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 - 30 0 30 60 90 120 150 uvlo_vb filtering time (s) t c (c) max. typ. min. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 - 30 0 30 60 90 120 150 uvlo_vcc filtering time (s) t c (c) max. typ. min. 0 50 100 150 200 250 300 350 400 - 30 0 30 60 90 120 150 i in ( a ) t c (c) inhx or inlx = 5 v max. typ. min.
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 36 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 figure 15- 13. high level input signal threshold voltage, v ih vs. t c figure 15- 14. low level input signal threshold voltage, v il vs. t c figure 15- 15. minimum transmittable pulse width for high - side switching, t hin(min) vs. t c figure 15- 16. minimum transmittable pulse width for low - side switching, t lin(min) vs. t c figure 15- 17. fo x pin voltage in normal operation, v fol vs. t c figure 15- 18. o cp threshold voltage, v trip vs. t c 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 - 30 0 30 60 90 120 150 v ih (v) t c (c) max. typ. min. 0.8 1.0 1.2 1.4 1.6 1.8 2.0 - 30 0 30 60 90 120 150 v il (v) t c (c) max. typ. min. 0 50 100 150 200 250 300 350 400 450 500 - 30 0 30 60 90 120 150 t hin(min) (ns) t c (c) max. typ. min. 0 50 100 150 200 250 300 350 400 450 500 - 30 0 30 60 90 120 150 t lin(min) (ns) t c (c) max. typ. min. 0 50 100 150 200 250 300 - 30 0 30 60 90 120 150 v f ol ( mv) t c (c) fox pull - up voltage = 5 v, r fo = 3.3 k , fox in logic low max. typ. min. 460 470 480 490 500 510 520 530 540 - 30 0 30 60 90 120 150 v trip (mv) t c (c) max. typ. min.
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 37 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 figure 15- 19. blanking time, t bk + propagation delay, t delay vs. t c figure 15- 20. o cp hold time, t p vs. t c figure 15- 21. filtering time of simultaneous on - state prevention vs. t c figure 15- 22. sd pin filtering time , t fil(sd) vs. t c figure 15- 23. v - phase shutdown period, t d(sd) vs. t c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 - 30 0 30 60 90 120 150 t bk + t delay (s) t c (c) max. typ. min. 0 5 10 15 20 25 30 35 40 45 50 - 30 0 30 60 90 120 150 t p (s) t c (c) max. typ. min. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 - 30 0 30 60 90 120 150 filtering time of simultaneous on - state prevention (s) t c (c) max. typ. min. 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 - 30 0 30 60 90 120 150 t fil(sd) (s) t c (c) max. typ. min. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 - 30 0 30 60 90 120 150 t d(sd) (s) t c (c) max. typ. min. c fo = 1000 pf
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 38 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.3. performance curves of output parts 15.3.1. output transistor performance curves 15.3.1.1. scm12 71m f figure 15- 24. igbt v ce(sat) vs. i c figure 15- 25. freewheeling diode v f vs. i f 15.3.1.2. scm12 7 2mf figure 15- 26. igbt v ce(sat) vs. i c figure 15- 27. freewheeling diode v f vs. i f 0.0 0.5 1.0 1.5 2.0 2.5 0 1 2 3 4 5 6 7 8 9 10 v ce(sat) (v) i c (a) vccx = 15 v 75 c 125 c 25 c 0.0 0.5 1.0 1.5 2.0 2.5 0 1 2 3 4 5 6 7 8 9 10 v f (v) i f (a) 125 c 75 c 25 c 0.0 0.5 1.0 1.5 2.0 2.5 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 v ce(sat) (v) i c (a) 125 c 25 c 75 c vccx = 15 v 0.0 0.5 1.0 1.5 2.0 2.5 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 v f (v) i f (a) 75 c 25 c 125 c
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 39 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.3.1.3. scm12 74mf figure 15- 28. igbt v ce(sat) vs. i c figure 15- 29. freewheeling diode v f vs. i f 15.3.1.4. scm12 7 6mf figure 15- 30. igbt v ce(sat) vs. i c figure 15- 31. freewheeling diode v f vs. i f 0.0 0.5 1.0 1.5 2.0 2.5 0 2 4 6 8 10 12 14 16 18 20 v ce(sat) (v) i c (a) 75 c 125 c 25 c vccx = 15 v 0.0 0.5 1.0 1.5 2.0 2.5 0 2 4 6 8 10 12 14 16 18 20 v f (v) i f (a) 75 c 25 c 125 c 0.0 0.5 1.0 1.5 2.0 2.5 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 v ce(sat) (v) i c (a) 25 c 75 c 125 c vccx = 15 v 0.0 0.5 1.0 1.5 2.0 2.5 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 v f (v) i f (a) 75 c 25 c 125 c
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 40 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.3.2. switching losses conditions: vbb = 300 v, half - bridge circuit with inductive load. 15.3.2.1. scm12 71m f figure 15- 32. high- side switching loss (t j = 25 c ) figure 15- 33. low - side switching loss (t j = 25 c ) figure 15- 34. high- side switching loss (t j = 125 c ) figure 15- 35. low - side switching loss (t j = 125 c ) 0 100 200 300 400 500 0 1 2 3 4 5 6 7 8 9 10 e ( j) i c (a) vbx = 15 v turn -on turn - off scm1271mf 0 100 200 300 400 500 0 1 2 3 4 5 6 7 8 9 10 e ( j) i c (a) vccx = 15 v turn -on turn - off scm1271mf 0 100 200 300 400 500 0 1 2 3 4 5 6 7 8 9 10 e ( j) i c (a) vbx = 15 v turn -on turn - off scm12171mf 0 100 200 300 400 500 0 1 2 3 4 5 6 7 8 9 10 e ( j) i c (a) vccx = 15 v turn -on turn - off scm1271mf
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 41 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.3.2.2. scm12 72mf figure 15- 36. high- side switching loss (t j = 25 c ) figure 15- 37. low - side switching loss (t j = 25 c ) figure 15- 38. high- side switching loss (t j = 125 c ) figure 15- 39. low - side switching loss (t j = 125 c ) 0 100 200 300 400 500 600 700 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 e ( j) i c (a) vbx = 15 v turn -on turn - off scm1272mf 0 100 200 300 400 500 600 700 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 e ( j) i c (a) vccx = 15 v turn -on turn - off scm1272mf 0 100 200 300 400 500 600 700 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 e ( j) i c (a) vbx = 15 v turn -on turn - off scm12172mf 0 100 200 300 400 500 600 700 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 e ( j) i c (a) vccx = 15 v turn -on turn - off scm1272mf
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 42 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.3.2.3. scm12 74mf figure 15- 40. high- side switching loss (t j = 25 c ) figure 15- 41. low - side switching loss (t j = 25 c ) figure 15- 42. high- side switching loss (t j = 125 c ) figure 15- 43. low - side switching loss (t j = 125 c ) 0 200 400 600 800 1000 1200 0 2 4 6 8 10 12 14 16 18 20 e ( j) i c (a) vbx = 15 v turn -on turn - off scm1274mf 0 200 400 600 800 1000 1200 0 2 4 6 8 10 12 14 16 18 20 e ( j) i c (a) vccx = 15 v turn -on turn - off scm1274mf 0 200 400 600 800 1000 1200 0 2 4 6 8 10 12 14 16 18 20 e ( j) i c (a) vbx = 15 v turn -on turn - off scm12174mf 0 200 400 600 800 1000 1200 0 2 4 6 8 10 12 14 16 18 20 e ( j) i c (a) vccx = 15 v turn -on turn - off scm1274mf
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 43 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.3.2.4. scm12 7 6mf figure 15- 44. high- side switching loss (t j = 25 c ) figure 15- 45. low - side switching loss (t j = 25 c ) figure 15- 46. high- side switching loss (t j = 125 c ) figure 15- 47. low - side switching loss (t j = 125 c ) 0 200 400 600 800 1000 1200 1400 0 5 10 15 20 25 30 e ( j) i c (a) vbx = 15 v turn -on turn - off scm1276mf 0 200 400 600 800 1000 1200 1400 0 5 10 15 20 25 30 e ( j) i c (a) vccx = 15 v turn -on turn - off scm1276mf 0 200 400 600 800 1000 1200 1400 0 5 10 15 20 25 30 e ( j) i c (a) vbx = 15 v turn -on turn - off scm1276mf 0 200 400 600 800 1000 1200 1400 1600 1800 0 5 10 15 20 25 30 e ( j) i c (a) vccx = 15 v turn -on turn - off scm1276mf
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 44 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.4. allowable effective current curves the following curves represent allowable effective currents in 3 - phase sine - wave pwm driving with parameters such as typical v ce(sat) and typical switching losses. operating conditions: vbb pin input voltage, v dc = 300 v; vcc pin input voltage, v cc = 15 v; modulation index, m = 0.9; motor power factor, cos = 0.8; junction temperature, t j = 150 c. 15.4.1. scm12 7 1mf figure 15- 48. allowable effective current ( f c = 2 khz ) : scm12 7 1mf figure 15- 49. allowable effective current ( f c = 16 khz ) : scm12 7 1mf 0 2 4 6 8 10 25 50 75 100 125 150 allowable effective current curves (arms) t c ( c ) f c = 2 khz 0 2 4 6 8 10 25 50 75 100 125 150 allowable effective current curves (arms) t c ( c ) f c = 16 khz
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 45 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.4.2. scm12 72mf figure 15- 50. allowable effective current ( f c = 2 khz ) : scm12 72mf figure 15- 51. allowable effective current ( f c = 16 khz ) : scm12 72mf 0 5 10 15 25 50 75 100 125 150 allowable effective current curves (arms) t c ( c ) f c = 2 khz 0 5 10 15 25 50 75 100 125 150 allowable effective current curves (arms) t c ( c ) f c = 16 khz
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 46 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.4.3. scm12 74mf figure 15- 52. allowable effective current ( f c = 2 khz ) : scm12 74mf figure 15- 53. allowable effective current ( f c = 16 khz ) : scm12 74mf 0 5 10 15 20 25 50 75 100 125 150 allowable effective current curves (arms) t c ( c ) f c = 2 khz 0 5 10 15 20 25 50 75 100 125 150 allowable effective current curves (arms) t c ( c ) f c = 16 khz
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 47 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.4.4. scm12 76mf figure 15- 54. allowable effective current ( f c = 2 khz ) : scm12 76mf figure 15- 55. allowable effective current ( f c = 16 khz ) : scm12 76mf 0 5 10 15 20 25 30 25 50 75 100 125 150 allowable effective current curves (arms) t c ( c ) f c = 2 khz 0 5 10 15 20 25 30 25 50 75 100 125 150 allowable effective current curves (arms) t c ( c ) f c = 16 khz
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 48 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.5. short circuit soas (safe operating areas) conditions: v dc 400 v, 13.5 v v cc 16.5 v, t j = 125c, 1 pulse. 15.5.1. scm12 7 1mf 15.5.2. scm12 72mf 0 50 100 150 200 0 1 2 3 4 5 collector current, i c(peak) (a) pulse width (s) short circuit soa 0 50 100 150 200 250 0 1 2 3 4 5 collector current, i c(peak) (a) pulse width (s) short circuit soa
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 49 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 15.5.3. scm12 74mf 15.5.4. scm12 7 6mf 0 50 100 150 200 250 300 0 1 2 3 4 5 collector current, i c(peak) (a) pulse width (s) short circuit soa 0 50 100 150 200 250 300 350 400 0 1 2 3 4 5 collector current, i c(peak) (a) pulse width (s) short circuit soa
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 50 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 16. pattern layout example this section contains the schematic diagrams of a pcb pattern layout example using an SCM1270MF series device. for reference terminal hole sizes, see section 10.3 . figure 16- 1 . top view figure 16- 2 . bottom view sv1 sv3 sv2 ipm1
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 51 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 vb 1 fo 1 ocp 1 lin 1 com 1 hin 1 vcc 1 hs 1 vbb w ls 3 v ls 2 u ls 1 vb 2 sd vt lin 2 com 2 hin 2 vcc 2 hs 2 vb 3 fo 3 ocp 3 lin 3 com 3 hin 3 vcc 3 hs 3 1 3 4 5 6 7 9 8 11 12 14 13 15 16 17 20 21 22 23 24 25 26 28 29 31 32 33 27 18 10 2 30 r 17 c 20 c 1 c 2 c 3 r 1 r 11 r 12 r 13 c 13 d 1 c 21 c 14 c 15 c 16 c 17 c 18 c 19 c 5 c 23 r 5 r 6 r 7 r 8 r 9 r 10 r 14 1 2 3 sv 1 r 2 d 2 c 24 r 15 r 3 d 3 c 25 r 16 d 4 c 4 1 2 3 4 5 6 7 8 9 10 1 2 sv 2 sv 3 19 c 6 c 7 c 8 c 9 c 10 c 11 r 4 11 12 13 d 5 d 6 d 7 r 19 r 18 jp 1 jp 2 ipm 1 figure 16- 3 . circuit diagram of pcb pattern layout example
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 52 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 17. typical motor driver application this section contains the information on the typical motor driver application listed in the previous section, including a circuit diagram, specifications, and the bill of the materials used. motor driver specifications ic scm12 7 2mf main supply voltage , v dc 300 v dc ( t yp.) rated output power 1.35 kw circuit diagram see figure16 - 3 . bill of materials symbol part type rating s symbol part type rating s c1 electrolytic 47 f, 50 v d5 general 1 a, 50 v c2 electrolytic 47 f, 50 v d6 general 1 a, 50 v c3 electrolytic 47 f, 50 v d7 general 1 a, 50 v c4 electrolytic 100 f, 50 v r1 * metal plate 18 m , 2 w c5 ceramic 100 p f, 50 v r2 * metal plate 18 m m , 1/8 w c8 ceramic 100 p f, 50 v r5 general 100 f, 50 v f, 50 v r11 general 200 , 1/8 w c16 ceramic 0.1 f, 50 v f, 50 v f, 50 v r14 * general open c19 ceramic 0.1 f, 50 v f, f, 50 v f, 50 v f, 50 v
SCM1270MF series SCM1270MF - dse rev. 1.4 s anken e lectric c o ., l td. 53 aug. 9, 2 01 8 http://www.sanken - ele.co.jp/en ? s anken e lectric c o ., l td. 2017 important notes all data, illustrations, graphs , tables and any other information included in this document (the ? information ? ) as to sanken? s products listed herein (the ? sanken products?) are current as of the date this document is issued . the information is subject to any change without notice due to improvement of the sanken products , etc. please make sure to confirm with a sanken sales repr esentative that the contents set forth in this document reflect the latest revisions before use. the sanken products are intended for use as components of general purpose electronic equipment or apparatus (such as home appliances, office equipment, telecom munication equipment, measuring equipment, etc.). prior to use of the sanken products, please put your signature, or affix your name and seal, on the specification documents of the sanken products and return them to sanken. when considering use of the sank en products for any applications that require high er reliability (such as transportation equipment and its control systems, traffic signal control systems or equipment , disaster/crime alarm systems, various safety devices, etc.), you must contact a sanken sales representative to discuss the suitability of such use and put your signature, or affix your name and seal, on the specification documents of the sanken products and return them to sanken, prior to the use of the sanken products . the sanken products are not intended for use in any applications that require extremely high reliability such as: aerospace equipment; nuclear power control systems; and medical equipment or systems, whose failure or malfunction may result in death or se rious injury to people, i.e., medical devices in class iii or a higher class as defined by relevant laws of japan (collectively, the ?specific applications?). sanken assumes no liability or responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, resulting from the use of the sanken products in the specific applications or in manner not in compliance with the instructions set forth herein. in the event of using the sanken p roducts by either (i) comb ining other products or materials or both therewith or (ii) physically, chemically or otherwise processing or treating or both the same , you must duly consider all possible risks that may result from all such uses in advance and proceed therewith at your o wn responsibility. although sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the occurrence of any failure or defect or both in semiconductor products at a certain rate. you must take, at your own responsibility , preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which the sanken products are used, upon due consideration of a failure occurrence rate and derating, etc., in order not to cause any human injury or death, fire accident or social harm which may result from any failure or malfunction of the sanken products. please refer to the relevant specification documents and sanken ? s official website in relation to derating. no a nti - radioactive ray design ha s been adopted for the sanken p roducts. the c ircuit constant , operation examples, circuit examples, pattern layout examples, design examples , recommended examples , all information and evaluation results based ther eon, etc., described in this document are presented for the sole purpose of reference of use of the sanken products . sanken assume s no responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, or an y possible infringement of any and all property rights including intellectual property rights and any other rights of you, u sers or any third party , result ing from the information . no information in this document can be transcribed or copied or both withou t sanken?s prior written consent. regarding the information, no license, express, implied or otherwise, is granted hereby under any intellectual property rights and any other rights of sanken. unless otherwise agreed in writing between sanken and you, sanken makes no warranty of any kind, whether express or implied, including, without limitation, any warranty (i) as to the quality or performance of the sanken products (such as implied warr anty of merchantability, and implied warranty of fitness for a pa rticular purpose or special environment), (ii) that any sanken product is delivered free of claims of third parties by way of infringement or the like, (iii) that may arise from course of performance , course of dealing or usage of trade, and (iv) as to the information (includ ing its accuracy, usefulness, and reliability). in the event of using the sanken products, you must use the same after carefully examining all applicable environmental laws and regulations that regulate the inclusion or use or both of a ny particular controlled substances, including , but not limi ted to , the eu rohs directive , so as to be in strict compliance with such applicable laws and regulations . you must not use the sanken products or the information for the purpose of any military a pplications or use, including but not limited to the development of weapons of mass destruction. in the event of exporting the sanken products or the information , or providing them for non - residents, you must comply with all applicable export control laws and regulations in each country including the u.s. export administration regulations (ear) and the foreign exchange and foreign trade act of japan , and follow the procedures required by such applicable laws and regulations. sanken assumes no responsibility for any troubles, which may occur during the transportation of the sanken products including the falling thereof, out of sanken?s distribution network. although sanken has prepared this document with its due care to pursue the accuracy thereof, sanken does not warrant that it is error free and sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting from any possible error s or omissions in connection with the informatio n . please refer to our official website in relation to general instructions and directions for us ing the sanken products , and refer to the relevant specification documents in relation to particular precautions when using the sanken products. all rights and title in and to any specific trademark or tradename belong to sanken and such original right holder(s). dsgn - cez - 1600 3

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